High Frequency Circuit Board Materials - メーカー・企業と製品の一覧 | イプロス

[Book] Latest Development Trends in High-Speed and High-Frequency Compatible Materials (2089BOD)

[Specialized Books] "Development of Low Dielectric Constant and Low Dielectric Loss Materials," "Millimeter Wave Compatible Electromagnetic Wave Absorbing and Shielding Materials," "Design of Antennas for 5G."

■ Points of this Book 【High-Frequency Substrate Materials】 - Characteristics and development of various substrate materials such as epoxy, polyimide, liquid crystal polymer, and fluorine - Development of new resins for 5G that achieve both "high heat resistance and low dielectric properties" - Surface modification and bonding techniques that enhance the adhesion between copper and resin without compromising smoothness 【5G Antennas】 - Antenna design technology for 5G smartphones - Reflectors and area construction applying metamaterial/metasurface technology - Antenna RF front-end modules that realize Massive MIMO in the high SHF band 【Electronic Components for 5G/Beyond 5G】 - Characteristics and technological trends of ceramic capacitors required for 5G - Technological trends and high-frequency advancements of SAW filters for 5G - Research and development trends of compound semiconductor devices for terahertz wireless communication 【Electromagnetic Wave Absorption and Shielding Materials】 - Design methods for wave absorbers and wave shields compatible with 5G millimeter waves - Applications of ceramics and carbon materials for wave absorption and shielding materials for millimeter waves 【Development and Integration Technology of Optical Devices】 - Development and integration technology of optical waveguides, optical modulators, and optical transceivers - Optical connection components and optical connection technology aimed at achieving co-packaging